Material integrity problem

Child codes

• XE0HB – Degraded
• XE0RF – Material disintegration
• XE1LJ – Material deformation
• XE2G9 – Material discoloured
• XE38M – Crack
• XE4FP – Material split, cut or torn
• XE585 – Material opacification
• XE5EZ – Explosion
• XE609 – Scratched material
• XE638 – Burst container or vessel
• XE6G0 – Material rupture
• XE6K7 – Material separation
• XE72S – Material protrusion or extrusion
• XE8D2 – Break
• XE9AR – Material perforation

Sibling codes

• XE0AG – Use of device problem
• XE0JD – Communication or transmission problem
• XE16C – Electrical or electronic property problem
• XE1W0 – Appropriate term or code not available for aspects of incidents related to devices
• XE1XC – Protective measures problem
• XE28Y – Output problem
• XE2GF – Mechanical problem
• XE2H3 – Installation related problem
• XE3DN – No apparent adverse event
• XE3GL – Adverse event without identified device or use problem
• XE3J4 – Labelling, instructions for use or training problem
• XE3UR – Connection problem
• XE452 – Compatibility problem
• XE4GH – Activation, positioning or separation problem
• XE4HK – Patient device interaction problem
• XE4XW – Contamination or decontamination problem
• XE52X – Chemical problem
• XE55U – Calibration problem
• XE586 – Temperature problem
• XE5DG – Human-device interface problem
• XE6K5 – Environmental compatibility problem
• XE7NV – Infusion or flow problem
• XE7Q8 – Manufacturing, packaging or shipping problem
• XE85E – Computer software problem
• XE941 – Optical problem

Foundation entity

Material integrity problem – http://id.who.int/icd/entity/1782857886